An automated multiport wafer level measurement system consists of the probe system, a multiport vna, calibration substrates, wafer probes, a control pc with software and interfaces between the pc, the probe system and the vna see figure 1. Current wlcsp ftfinal test contactor technologies, which already use similar sockets and rf pogo pins, so that a similar approach can be also used in wafer level probe card form is. Wafer level reliability wafer level reliability testing. Bonding reliability testing for wafer level packaged mems.
Waferlevel highpower device testing evaluation engineering. Capture offset data for accurate calibration of transfer positions as the wafer like ats moves through your semiconductor equipment. This type of testing applies a high level of stress to special test structures on the wafer and measures the degradation caused by this stress. Perform automatic waferlevel test up to 3kv in a single probe touchdown. Several generations of keithleys parametric test solutions have offered wlr test algorithm libraries as options. Prober assistant measurement system pams is a computer program that automates the timeconsuming process of testing microfabricated devices integrated circuits andor microelectromechanical systems at the wafer level. Although it requires a new generation of test equipment, testing mems devices is challenging but not impossible. Safely rely on test results to adjust manufacturing process parameters to maximize. Calibration software for automated multiport wafer level. Atspeed waferlevel testing and fullcontact waferlevel burnin after. Naturally, test technology must follow ic process changes.
The longterm requirement will be for ever higher levels of automation and highly parallel, mixedsignal electrooptical testing concepts, both on and off wafer. One method stimulates the device electrically, and then movement is detected and measured. Sti3000 wafer probe test system solidus technologies, inc. Fast wafer level reliability program wlr process reliability factors chapter 4 mn103. Dedicated software available for leak measurement and judgment. Wafer level test engineers need to reduce test time without sacrificing measurement quality and accuracy. Software testing process basics of software testing life.
This article discusses waferlevel measurements of mems dynamics. Much of the testing is the same in both packaged device and wlr testing, allowing for relatively easy migration to wafer level testing. Wafer or chip level test description ic design verification preproduction wafer level characterize, debug and verify new chip design to insure it meets specifications. We offer a complete line of premium performance analytical probe stations for on wafer probing and board test that help increase process performance while.
Customize your waferlevel testing process using our proprietary software and fullyautomated probe station. Wafer level disposition technology based on regional spatial and automatic pattern detection analysis endtoend connectivity using openstandards enabling adaptive test and adaptive feedforward, single device traceability sdt and intelligent recall through technology partnership with kinesys software. Inline parametric test wafer fabrication wafer level production process verification test performed early in the fabrication cycle near frontend of line to monitor process. Wafer level mems testing prior to packaging is an increasingly important measurement for achieving high yield and reliability at. Waferlevel reliability wlr testing receives much attention and becomes a major tool for process reliability qualification. Utilizing system level testing slt as a third test process, following wafer and package test, enables the component manufacturer to test software and. Testing inertial sensors at wafer level often requires test within a vacuum environment to eliminate the friction effects of air on device components. Sti3000 wafer probe test system solidus technologies. A costeffective approach for wafer level chip scale.
Automated testing procedures can be used to accelerate data acquisition when measures have to be repeated several times at different locations on the wafer, for instance in a wafer level failure analysis process. At the core of the test system is stis proprietary drive sense technology dst. Hedw5100d auto probe station and wafer mapping program enabled fully automated wafer level esd testing. Bonding reliability testing for wafer level packaged mems devices. This is done automatically using a wafer probing system see fig. Test system checks for esd problems at the wafer level. Us5822717a method and apparatus for automated wafer level. This process leads to the use of progressively fewer electrical. And, as more products are developed for implementation as rficsmmics, the importance of on wafer testing will continue to grow. I like to define testing as the process of validating that a piece of software meets its business and technical requirements. Jun 15, 2017 basically its testing devices and ics while they are still on the wafer used to manufacture semiconductor ics.
Ic designers are now designing complete systemonchip soc products that contain processor, ad and da converter, digital io, modem andor other ip blocks along with embedded software. Dst combines unique circuitry, software and test methods to produce the. Wafer level reliability wlr testing also eliminates much of the time, production capacity, money, and material lost if the packaged device fails. Oct 01, 2005 an automated multiport wafer level measurement system consists of the probe system, a multiport vna, calibration substrates, wafer probes, a control pc with software and interfaces between the pc, the probe system and the vna see figure 1. Flexible configurations allow the customer to choose test equipment configurations from the spectrum meter, photo detector and source measurement unit in accordance with your. Inline process monitoring applications seek to continuously verify the wafer manufacturing process, watching for any failures in the production flow. The acs software platform supports semiconductor characterization at the cassette, wafer, and device levels using multiple test instruments, and automatic parametric test with semiautomatic and automatic probe stations. The system was used to test individual mems inertial devices, and was also tested with a semiautomated probe station for testing and characterization of mems at the wafer level. Burnin is a temperaturebias reliability stress test used in detecting and screening out potential early life failures. Jun 27, 2016 fanout wafer level packaging fowlp has been described as a game changer by industry experts because of its thin form factor, low cost of ownership, and ease of integration using conventional. You do this by contacting the bond pads later used to connect to the package using tiny needles. Keithley instruments has long been an industry leader in both overall parametric test technology and wafer level reliability wlr testing.
Only with a good correlation can a comparison of the achieved results be undertaken thus giving the test engineer confidence in his early testing. You may have heard of wafer sort or wafer testing, which is a part of the testing process performed on silicon wafers. The pac200 semiautomated cryogenic probe station is the ideal solution for automatic testing of wafers and substrates up to 300 mm in a cryogenic pro. However, these highvolume manufactured devices also present a number of challenges during device testing. Over the years, ive noticed how process and methodology play an important. Bringing optical test deeper from package level into the semiconductor process is an important step to assure performance and yield.
However, the testing of multiple cores of a soc in parallel during wltbi leads to constantlyvarying device power during the duration of the test. Wafer level reliability testing a critical device and process development step may 2005 t he continuing push for more devices on a chip and faster clock speeds is driving the demand for shrinking geometries, new materials, and novel technologies. Open pad wafer level deebedding process help 4 wafer level cameras wlc 0 problem with detecting the vref of testing pad when doing wafer level testing 0. Burnin is a temperaturebias reliability stress test used in detecting and. Mar 05, 2019 these tests can be performed on a wafer or packaged part. Accurate waferlevel testing across extended temperature. A costeffective waferlevel reliability test system for integrated circuit. Weve discussed a varied set of topics, and spent quite a bit of time discussing software development methodology agile, waterfall, scrum, vmodel, etc. The physical constraints introduced by multisite wafer level chip scale testing has presented challenges to traditional techniques used for. Wafer testing is a step performed during semiconductor device fabrication. We offer a complete line of premium performance analytical probe stations for on wafer probing and board test that help increase process performance while reducing cost of ownership.
We offer a complete line of premium performance analytical probe stations for onwafer probing and board test that help increase process performance while. Testing and characterization at the wafer level is very important since relevant information regarding the process variability within the same batch, and critical information about the process that can later be used to improve the design can be derived. This software testing guide is the next inline topic to what we have discussed earlier. Testing is the primary avenue to check that the built product meets requirements adequately. Waferlevel packaging and test, technologies and trends. With the advent of the 5g era, global dram bitbased consumption is expected to approximately double by 2023, and wafer level memory burnin test. The sti3000 is a waferlevel mems and mixed signal asic probe test system that combines several functional sti test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal asics.
The process is configured and run from precio, imina technologies software suite. How to couple light into a photonics chip wafer level. Improve the yield of your manufacturing process with calibrated equipment. Our probe systems are available with a complete set of accessories such as microscopes, thermal control systems, software and industryleading probes. Oct 08, 2010 electroglas provides advanced wafer probers, device handlers, test floor management software and services with modern tools for semiconductor industry. The internet defines software testing as the process of executing a program or application with the intent of identifying bugs. Test acuity solutions tas software for corporate test.
Silicon photonics probing applications typically fall into the category of either modeling and characterization, wafer acceptance testing, or production process monitoring. Software for waferlevel testing of microfabricated devices. The advantage of wafer level testing is that these semiconductor devices can. How to correlate wafer level test to final product test. With the advancement of wafer bonding technologies and equipment, many mems devices in the market today are packaged at wafer level. Wafer space achieves this with its turnkey engineering capability. Prochek for waferlevel reliability wlr the semiconductor process characterization solution ridgetop groups prochek is an innovative system to qualify the performance and characterize the intrinsic reliability of deep submicron nanotechnology cmos processes for microelectronics applications. Keithley automated characterization suite acs software. A measurement method for waferlevel 1f noise solid. Waferlevel testing and test during burnin for integrated. Onwafer testing verifies ic performance and process yield. At the same time, this progression has also led to the need for development of bond quality testing, especially useful for applications and devices that operate in either pressurized or vacuum environments. Through this stepbystep process, we can characterize each wafer and lot based on its temperature performance.
Ccd camera equipped supports up to 12inch 300mm wafer. In contrast, another swtw 2005 paper described the results of wafer production testing using a liquid interface to a thermal chuck. A smarter approach to wafer level parametric test as ic manufacturers continue to introduce new and innovative processes with decreasing device geometries, they need to ensure the additional complexity from these changes does not affect the. Calibration software for automated multiport wafer level testing. The process involves several stepsmore for safety critical applications such as automotive. With mass production experience, tester functions include flexible recipe management, accurate calibration, and statistical analysis. Since 2008, mpis led tester has provided optical and electrical measurements. Audette of ibm microelectronics focuses on the wafertochuck interface as the largest source of high thermal resistance. Fullyautomated capabilities to test individual wafers or an entire cassette. Em wlr tools are now available to study underlying intrinsic failure mechanisms of em plr, applying the same test algorithms and test conditions directly on the wafer. Wafer space can take any specification or an existing design and execute the complete rtl design, integration, verification, stasynthesis, physical design and dft and tapeout a design. Fast wafer level reliability program wlr process improvement sequence chapter 3 mn103. Pams was written specifically for use with the karl suss probe station a commercially available wafer testing apparatus and is compatible with associated testing circuitry. Affordable and versatile manual wafer level tester.
Under software control, it can monitor, capture, and analyze the output signals. Wafer level reliability testing a critical figure 1. On wafer testing provides data that cannot be obtained by any other method. Technologies for photonics assembly and testing ficontec. Wlr tools in acs software allow testing multiple devices in parallel while applying different stress conditions to each device. The process of wafer testing can be referred to in several ways. This ongoing expansion in the number of required temperature steps during waferlevel testing can quickly consume a significant share of. The process uses test patterns to find any defects and thus eliminate the wafer from the next step in the process. Wafer level test during burn in wltbi is an emerging practice in the semiconductor industry that allows testing to be performed simultaneously with burn in at the wafer level.
Stressmeasure technique for wlr tests stressmeasure testing is a technique. As ic manufacturers continue to introduce new and innovative processes with decreasing device. A key aspect of testing at the wafer, bar and chip stage is fast reproducible optical coupling, including probeposition optimization and polarization alignment. Last but not least, a main challenge is the correlation between the wafer level test and final test. Since process monitoring is a highvolume application, measurements tend to be optimized for speed while checking a minimum number of metrics. Methods and apparatus are disclosed for testing integrated circuits at the wafer level and for integrating test results, calculation of lifetimes and generation of trend charts in a common database following testing. Tutorial authors wanted high frequency electronicshas an ongoing commitment to providing tutorial level articles for our. Acs standard edition software is used in the integration phase for semiautomatic wafer testing including robust process development and wafer level reliability wlr. Silicon photonics how optical test works at the wafer. The most costeffective test solution is a single insertion at the wafer level that will fully test for defective parts and screen for infant mortalities. Wlr testing is a statistical process control tool that gathers data through parametric testing to identify process anomalies that could degrade longterm device reliability. Prochek for waferlevel reliability wlr ridgetop group. This software can be used for a smuperpin system level test. Waferlevel test during burnin wltbi is an emerging practice in the semiconductor industry that allows testing to be performed simultaneously with burnin at the waferlevel.
Wafer level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Wafer space is focused on providing high end services and true value to its customers. Each of these application categories places its unique relative emphasis on accuracy, throughput, and test flexibility. A typical wafer level test can be completed under 1. Atspeed wafer level testing and fullcontact wafer level burn in after flip chip bumping. Waferlevel test and burnin wlb waferlevel test and burnin wltbi refers to the process of subjecting semiconductor devices to electrical testing and burnin while they are still in wafer form. Testing mems at wafer level evaluation engineering.
The detection and evaluation of process dependent variables, like overetching in the production cycle, are achieved and presented. Electroglas provides advanced wafer probers, device handlers, test floor management software and services with modern tools for semiconductor industry. This in turn drives the need for full functional test at probe since traditional package and final test is eliminated from the manufacturing process. Fully integrated and automated waferprobing systems enable silicon photonic chip. Once an integrated circuit ic has been designed and the first silicon comes out, wafer level reliability wlr tests are performed to accelerate new ic designs and processes verification by assessing the reliability characteristics portion of the technology process. With wafer chip scale packing parallel test sites are no longer phys ically decoupled because they are all on the common wafer. Software is used to control the entire process, which steps the wafer and. Fullyautomated high voltage waferlevel testing tektronix. Wafer level reliability testing predicts reliable lifetimes for semiconductor components such as transistors, capacitors, and interconnects. Burnin is a temperaturebias reliability stress test used in detecting and screening out potential early life device failures. Because of these technology trends, fabs are making greater use of a methodology called wafer level reliability wlr testing. Mems microphone testing at the wafer level by david deroo, richard jones, gary morrell, daniel nix, hugh miller. Wafer level reliability wlr provides more data earlier in the manufacturing process without the cost and potential damage associated with cutting and packaging the ic. Highly parallel wafer level reliability systems with pxi smus.
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